Contact Springs / Spring Fingers for Connectors - Precision Stamped
Product Overview
Tingfeng Hardware supplies precision connector spring contacts for AI infrastructure and smart hardware, including high-speed board-to-board and FPC connectors. Using high-spring materials like phosphor bronze and beryllium copper, with progressive die high-speed stamping and stress relief, stable contact force and mating cycle life ≥5000 are ensured. Micro contacts with 0.3mm pitch are supported, customizable gold/tin plating. 15 years experience ensures stable and reliable signal transmission.
Technical Description
High-speed connector springs are critical for data transmission in AI servers and liquid cooling systems. Contact design balances low insertion force and high retention force, through precise cantilever calculation and die compensation, achieving normal force range 0.2N-1.5N, contact resistance below 30mΩ. For high-speed signal transmission, contact shape is optimized to reduce reflection and crosstalk. All products undergo 100% continuity testing and visual inspection, ready for automated placement. Complete inspection reports are provided with shipments.
Features & Advantages
| Feature |
Advantage to You |
| Micro-pitch stamping |
0.3mm pitch contacts formed in one step, meeting high-density needs |
| Low insertion force design |
Optimized arm shape, insertion force ≤0.8N, ideal for precision mating |
| High-reliability plating |
Controlled gold thickness, withstands mating, oxidation resistant, ensures signal integrity |
| Burr-free blanking |
Precise die clearance, burr ≤0.01mm, prevents short circuit risk |
| Fully automatic taping |
Tape & reel for pick-and-place, improving assembly efficiency |
Technical Specifications
| Specification Item |
Detail / Range |
Tolerance / Standard |
| Material |
Phosphor Bronze / BeCu / Stainless |
Tensile ≥600MPa |
| Thickness |
0.1 mm -- 0.3 mm |
±0.005mm |
| Contact Pitch |
0.3 mm -- 2.54 mm |
±0.02mm |
| Normal Force (working height) |
0.2 N -- 1.5 N |
±15% |
| Contact Resistance |
≤ 30 mΩ |
Initial |
| Mating Cycles |
≥ 5000 |
Resistance change ≤20% |
| Plating |
Gold / Tin / Silver |
Thickness 0.1-0.5μm |
| Packaging |
Tape & Reel (EIA-481) |
SMT ready |
Applications
- AI Infrastructure: AI server motherboard board-to-board connectors, GPU accelerator card high-speed connectors, liquid cooling system control board contacts
- Smart Hardware: Smart glasses FPC connector springs, AR/VR device internal connection contacts
- Communication Equipment: 5G base station high-speed connectors, optical module spring contacts
- Automotive Electronics: Smart cockpit infotainment connectors, sensor plugs
Frequently Asked Questions
Q: Can you handle complex custom designs and provide design optimization suggestions?
A: Absolutely. This is our core expertise. We provide free DFM analysis within 3-5 days, often helping clients achieve 15-30% cost reduction through design for manufacturability.
Q: How do you ensure quality consistency and handle defect issues?
A: We implement a rigorous 4-stage QC system with 100% full inspection. Our track record shows 99.99% qualification rate.
Q: What are your lead times and how do you handle urgent orders?
A: Standard lead times: 3-7 days for prototypes, 7-15 days for mass production. We offer VIP prioritization cutting lead times by up to 30%.
Q: Will I get timely responses and professional support throughout the project?
A: Yes. You get a 1v1 exclusive consultant with 1-hour initial response commitment and 24-hour technical support.
Q: Can you provide material certifications and environmental compliance reports?
A: Yes. We provide material certifications and environmental test reports (RoHS, REACH compliant) upon request.
Q: How do you protect my designs and intellectual property?
A: We start with mutual NDA and implement strict mold ownership protection and confidential data security measures.
Q: What are your payment terms and MOQ requirements?
A: We offer flexible payment terms (T/T, L/C at sight) and MOQ from 1 piece for prototyping.
